Features (Typical values are: VSUPPLY = 2.7V and CL = 10 pF, unless otherwise specified.) Small signal bandwidth 78 MHz Supply voltage range 2.4V to 5V Phase noise (VIN = 1 VPP, fC = 38.4 MHz, Δf = 1 kHz) −123 dBc/Hz Slew rate 106 V/μs Total supply current 2.3 mA Shutdown current 30 µA Rail-to-rail input and output Individual buffer enable pins Rapid Ton technology Crosstalk rejection circuitry Packages: 8-Pin LLP, Solder Bump and no Pullback 8-Bump micro SMD Temperature range −40°C to 85°C Description The LMH2180 is a high speed dual clock buffer designed for portable communications and applications requiring multiple accurate multi-clock systems. The LMH2180 integrates two 75 MHz low noise buffers with independent shutdown pins into a small package. The LMH2180 ensures superb system operation between the baseband and the oscillator signal path by eliminating crosstalk between the multiple clock signals. Unique technology and design provides the LMH2180 with the ability to accurately drive both large capacitive and resistive loads. Low supply current combined with shutdown pins for each channel means the LMH2180 is ideal for battery powered applications. This part does not use an internal ground reference, thus providing additional system flexibility. The flexible buffers provide system designers the capacity to manage complex clock signals in the latest wireless applications. Each buffer delivers 106 V/μs internal slew rate with independent shutdown and duty cycle precision. Each input is internally biased to 1V, removing the need for external resistors. Both channels have rail-to-rail inputs and outputs, a gain of one, and are AC coupled with the use of one capacitor. Replacing a discrete buffer solution with the LMH2180 provides many benefits: simplified board layout, minimized parasitic components, simplified BOM, design durability across multiple applications, simplification of clock paths, and the ability to reduce the number of clock signal generators in the system. The LMH2180 is produced in the tiny packages minimizing the required PCB space. Applications • 3G mobile applications • WLAN–WiMAX modules • TD_SCDMA multi-mode MP3 and camera • GSM modules • Oscillator modules

Typical Application MY BRIEFCASE                                       Click any "Briefcase" icon to add an item

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Datasheet

Title		Size	Date	Other Language
	LMH2180 75 MHz Dual Clock Buffer	523 Kbytes	21-Aug-08

Featured Application Notes

Title		Size	Date	Other Language
	AN-1863: Application Note 1863 LMH2180 Evaluation Board in micro SMD	236 Kbytes	21-Aug-08
	AN-1776: Application Note 1776 LMH2180 Evaluation Board in LLP	229 Kbytes	21-Aug-08	中文

More Application Notes

Title		Size	Date	Other Language
	AN-1681: Application Note 1681 Design Migration from the LM1881 to the LMH1980	143 Kbytes	2-Aug-07	日本語
	AN-1599: Application Note 1599 LMH1981 Evaluation Board Instruction Manual	503 Kbytes	11-Feb-09	日本語
	AN-1618: Application Note 1618 LMH1980 Evaluation Board Instruction Manual	674 Kbytes	19-Jul-07	日本語

Reliability Metrics

Part Number	Process	EFR Reject	EFR Sample Size	PPM	LTA Rejects	LTA Device Hours	FITS	MTTF (Hours)
LMH2180SD	CMOS7	0	18406	0	0	1089000	4	309006723
LMH2180SDE	CMOS7	0	18406	0	0	1089000	4	309006723
LMH2180SDX	CMOS7	0	18406	0	0	1089000	4	309006723
LMH2180TM	CMOS7	0	18406	0	0	1089000	4	309006723
LMH2180TMX	CMOS7	0	18406	0	0	1089000	4	309006723
LMH2180YD	CMOS7	0	18406	0	0	1089000	4	309006723
LMH2180YDX	CMOS7	0	18406	0	0	1089000	4	309006723

Note: The Early Failure Rates (EFR) were calculated as point estimate PPM based on rejects and sample size for EFR. The Long Term Failure Rates were calculated at 60% confidence using the Arrhenius equation at 0.7eV activation energy and derating the assumed stress temperature of 150°C to an application temperature of 55°C.

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