Features • DC - 1.0 Gbps low jitter, high noise immunity, low power operation • On-chip 100Ω input and output termination minimizes insertion and return losses, reduces component count and minimizes board space • 7 kV ESD on LVDS I/O pins protects adjoining components • Small 3 mm x 3 mm 8-LLP space saving package Description The DS10BR150 is a single channel 1.0 Gbps LVDS buffer optimized for high-speed signal transmission over lossy FR-4 printed circuit board backplanes and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity. Wide input common mode range allows the receiver to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. The differential inputs and outputs are internally terminated with a 100Ω resistor to lower device input and output return losses, reduce component count and further minimize board space. Applications • Clock and data buffering • OC-12 / STM-4 • FireWire 800

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Datasheet

Title		Size	Date	Other Language
	DS10BR150 1.0 Gbps LVDS Buffer / Repeater	394 Kbytes	8-Nov-07	日本語

Featured Application Notes

Title		Size	Date	Other Language
	AN-305: Precautions To Take When Driving Memories	97 Kbytes	4-Nov-95

More Application Notes

Title		Size	Date	Other Language
	AN-873: Architectural Choices for Network Performance	246 Kbytes	5-Aug-95

Design Tools

Title	Size	Date
DS10BR150 Evaluation Board Instructions and Gerber Files

Reliability Metrics

Part Number	Process	EFR Reject	EFR Sample Size	PPM	LTA Rejects	LTA Device Hours	FITS	MTTF (Hours)
DS10BR150TSD	BICMOS8B+	0	1152	0	0	743900	5	211083656
DS10BR150TSDX	BICMOS8B+	0	1152	0	0	743900	5	211083656

Note: The Early Failure Rates (EFR) were calculated as point estimate PPM based on rejects and sample size for EFR. The Long Term Failure Rates were calculated at 60% confidence using the Arrhenius equation at 0.7eV activation energy and derating the assumed stress temperature of 150°C to an application temperature of 55°C.

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