Selection Guide By Package Type


Plastic: COG    FBGA    ISOLATED TO220    LAMINATE CSP    LAMINATE TCSP    LAMINATE UCSP    LBGA    LLP    LLP COL    LQFP    LQFP EXP PAD    LTCC    MDIP    MICRO SMD    MICRO SMDXT    MICRO-ARRAY    MINI SOIC    MINI SOIC EXP PAD    PLCC    POS    PQFP    PSOP    SC-70    SOIC NARROW    SOIC WIDE    SOT-223    SOT-23    SSOP    SSOP-EIAJ    TEPBGA    TFBGA    TO-220    TO-247 SINGLE GAUGE    TO-252    TO-263    TO-263 THIN    TO-92    TQFP    TQFP EXP PAD    TSOT    TSSOP    TSSOP EXP PAD    UFBGA   

Hermetic: CCGA    CERDIP    CERPACK    CQFP    CQGP    CSOP    LCC    SIDEBRAZE    TO-100    TO-3    TO-39    TO-46    TO-5    TO-99    TO-PMOD   

Other: DIE    WAFER

64-pins    100-pins   
64-pins 
Product Folder
(Datasheet)		 Description Product Type Package Status
Type # pins MSL/Lead-Free Availability
LMH6583YA 16x8 550 MHz Analog Crosspoint Switch, Gain of 2TQFP EXP PAD
(VXE64A)		64 Status Full production
100-pins 
Product Folder
(Datasheet)		 Description Product Type Package Status
Type # pins MSL/Lead-Free Availability
SCAN12100TYA 1228.8 and 614.4 Mbps CPRI SerDes with Auto RE Sync and Precision Delay Calibration MeasurementTQFP EXP PAD
(VXF100B)		100 Status Full production
SCAN25100TYA 2457.6, 1228.8, and 614.4 Mbps CPRI SerDes with Auto RE Sync and Precision Delay Calibration MeasurementTQFP EXP PAD
(VXF100B)		100 Status Full production
SCAN25100TYAX 2457.6, 1228.8, and 614.4 Mbps CPRI SerDes with Auto RE Sync and Precision Delay Calibration MeasurementTQFP EXP PAD
(VXF100B)		100 Status Full production