SELECTION GUIDE BY PACKAGE TYPE

Plastic: COG    FBGA    ISOLATED TO220    LAMINATE CSP    LAMINATE TCSP    LAMINATE UCSP    LBGA    LLP    LLP COL    LQFP    LQFP EXP PAD    LTCC    MDIP    MICRO SMD    MICRO SMDXT    MICRO-ARRAY    MINI SOIC    MINI SOIC EXP PAD    PLCC    POS    PQFP    PSOP    SC-70    SOIC NARROW    SOIC WIDE    SOT-223    SOT-23    SSOP    SSOP-EIAJ    TEPBGA    TO-220    TO-247 SINGLE GAUGE    TO-252    TO-263    TO-263 THIN    TO-92    TQFP    TQFP EXP PAD    TSOT    TSSOP    TSSOP EXP PAD    UFBGA   

Hermetic: CCGA    CERDIP    CERPACK    CQFP    CQGP    CSOP    LCC    SIDEBRAZE    TO-100    TO-3    TO-39    TO-46    TO-5    TO-99   

Other: DIE    WAFER

292-pins   
292-pins 
Product Folder
(Datasheet)		 Description Product Type Package Status
Type # pins MSL/Lead-Free Availability
ADC10D1000CIUT Low Power, 10-Bit, Dual 1.0/1.5 GSPS or Single 2.0/3.0 GSPS A/D ConverterADC - Giga-SampleTEPBGA
(UFH292A)		292 Status Full production
ADC10D1500CIUT Low Power, 10-Bit, Dual 1.0/1.5 GSPS or Single 2.0/3.0 GSPS ADCADC - Giga-SampleTEPBGA
(UFH292A)		292 Status Full production