National's Other Packaging Information

Ball Grid Array, micro SMD, Laminate CSP and Leadless Leadframe Package (LLP) Packages

Ball Grid Array Package	Databook Information			Package Details including Marketing Drawings
Ball Grid Array Package	View Online	Download .	Receive via E-mail	Package Details including Marketing Drawings
Ball Grid Array AN-1126	View	Download 141 KB	E-mail	N/A
EBGA				Package Details Package Code: UA
FBGA				Package Details Package Code: SM, SLC
PBGA				Package Details Package Code: UC, U(X,X)

micro SMD

A COST-EFFECTIVE PACKAGE MINIATURIZATION SOLUTION
micro SMD Featured Product Site

Micro SMD (Surface-Mount Device) is a chip-size package and was developed by National Semiconductor. It is the same size as the silicon chip and is available in 4-, 5-, and 8-I/O packages. The advantages of micro SMD compared with traditional leaded plastic packages include:

Small footprint
High I/O density
Better electrical & thermal performance
Easy board assembly
Level 1 moisture sensitivity performance
Noise reduction

micro SMD Package	Databook Information			Package Details including Marketing Drawings
micro SMD Package	View Online	Download .	Receive via E-mail	Package Details including Marketing Drawings
micro SMD Wafer Level Chip Scale Package AN-1112	View	Download 3.5 MB	E-mail	N/A
Drawings				Package Details Package Code: BP

Leadless Leadframe Package (LLP)

Leadless Leadframe (LLP)	Databook Information			Package Details including Marketing Drawings
Leadless Leadframe (LLP)	View Online	Download .	Receive via E-mail	Package Details including Marketing Drawings
Leadless Leadframe Package (LLP) AN-1187	View	Download 3.3 MB	E-mail	N/A
Drawings				Package Details Package Code: LD, LQ

Laminate CSP

Laminate CSP	Databook Information			Package Details including Marketing Drawings
Laminate CSP	View Online	Download .	Receive via E-mail	Package Details including Marketing Drawings
Laminate CSP Packages AN-1125	View	Download 4.2 MB	E-mail	N/A
Drawings				Package Details Package Code: SL, SLB