|
Packaging | Lead-Free Status | Impact to Customers | Tin Whiskers
European Dir. Compliance | Industry Consortia | Questions & Answers | Literature
To order lead-free products, call your National Semiconductor distributors. They can order products for you with an "NOPB" specification, for example "LM324AM/NOPB".
This Web page allows you the opportunity to view specifics on the industry move to lead-free electronics, National's lead-free packaging strategy, and National's participation in lead-free consortia. For lead free availability of specific packages see the Selection Guide by Package Type. Click on the underlined titles to move to that section.
Most plastic and wafer level packages are currently available as lead-free. Commercial metal can packages are now available as lead-free.
The Issue
Due to environmental concerns around the world, lead-free solutions in electronic components and systems are being implemented within the semiconductor and electronics industries.
National Semiconductor Corp. strives to minimize the amount of disruption that the switch to lead-free products might entail. We look forward to working with our customers to provide you with the most cost-effective and reliable lead-free packaging solution for your needs.
National Semiconductor's Action
Currently National is an active participant in several industry consortia addressing lead-free processing. These groups are evaluating lead-free solder alloys with lead-free components and printed wiring board finishes. Several of the lead-free solder alloys being proposed require a maximum reflow temperature higher than the current peak temperature for Sn/Pb, which is between 220-235°C.
Impact of 260°C Peak Reflow
One major impact on the packaging industry will be the higher reflow temperature required for lead-free assembly, with 260°C often mentioned as the upper target. The high temperature ensures that all the components on a fully populated board will reach the melting temperature of the lead-free solder. A majority of plastic packages will have difficulty meeting such a constraint at JEDEC-defined moisture sensitivity levels 1 and 2. Currently, certain small packages such as SOP (Small Outline Packages) and TSSOP (Thin Shrink Small Outline Packages) can withstand the thermal strain without suffering from interfacial delamination, popcorn-induced cracking, or warping. However, larger packages will not meet this requirement. Their JEDEC moisture sensitivity level classification will most likely be downgraded by as many as two levels
Packaging | Lead-Free Status | Impact to Customers | Tin Whiskers
European Dir. Compliance | Industry Consortia | Questions & Answers | Literature
|
 |
|
- NAB 2009 - April 18-23, 2009, Las Vegas, Nevada
- APEC 2009 - February 15-19, 2009, Washington, DC
See all Events.
WEBENCH Power Designer
Design Made Easy
Go from sensor selection to hardware design in a matter of seconds.
- LM5085 - 75V Constant On-Time PFET Buck Switching Controller
- LMP2021 / 2022 - Single/Dual Zero Drift, Low Noise, EMI Hardened Amplifier
- ADC16V130 - Low Power, High Linearity IF and Baseband Dual 16 bit ADC Driver With Digitally Controlled Gain
- LMH6517 - Low Power, High Linearity IF and Baseband Dual 16 bit ADC Driver With Digitally Controlled Gain
- ADC10D1000 - Low Power, 10-Bit, Dual 1.0 GSPS or Single 2.0 GSPS A/D Converter
- LMH6554 - 2.5 GHz Ultra Linear Fully Differential Amplifier
- LM315x - New SIMPLE SWITCHER® Synchronous Controllers
- LM2267x - New SIMPLE SWITCHER Step-down Voltage Regulators
- LM3421, LM3423 - Versatile High Voltage LED Driver Controllers
- LMK04000 Family - Precision Jitter Cleaners with Cascaded PLLatinum® PLLs
- LMH6553 - 900 MHz Fully Differential Amplifier with Output Limiting Clamp
- LM48100Q - Mono, 1.3W Auto Grade Audio Power Amplifier with Output Fault Detection and Volume Control
- LM95172QA2-MDA - 13-Bit to 16-Bit Digital Temp Sensor with Dual Supply and 3-Wire Interface
- ADC161S626 - 16-Bit, 50 to 250 kSPS, Differential Input, MicroPower ADC
Maximizing Solar Panel Efficiency
National's SolarMagic™ technology recoups up to 50 percent of the lost energy, dramatically improving the economics in shaded and other real-world conditions. |
|
