Packaging

National myb20aa Package 20L TSSOP EXP PAD, 6.50 x 4.40 x 0.90mm body size
TSSOP EXP PAD Selection Guide Download CAD schematic symbols and PCB footprints Standards JEDEC Spec: MO-153 ACT Body Size Wide Nom. 6.50 mm Long Nom. 4.40 mm Thickness 0.90 mm Pitch 0.65 mm myb20aa Mechanical Drawing (145 Kbytes) Download myb20aa STEP Model File (145 Kbytes) Download	Note: Lead count on this 3D picture may be different. This picture depicts the package type.

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