Packaging

National muy08a Package 8L MINI SOIC EXP PAD, 118.00 x 118.00 x 34.00mils body size
MINI SOIC EXP PAD Selection Guide

Download CAD schematic symbols and PCB footprints

Standards JEDEC Spec: MO-187 AA

Body Size
Wide Nom.118.00mils
Long Nom.118.00mils
Thickness34.00mils
Pitch25.6mils

muy08a Mechanical Drawing (112 Kbytes)
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Note: Lead count on this 3D picture may be different. This picture depicts the package type.


[Information as of 10-Feb-2012]