National Semiconductor | High-performance Analog

 

 DS90C383   

+3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz [Not recommended for new designs]
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Features
  • 20 to 65 MHz shift clock support
  • Programmable transmitter (DS90C383) strobe select (Rising or Falling edge strobe)
  • Single 3.3V supply
  • Chipset (Tx + Rx) power consumption < 250 mW (typ)
  • Power-down mode (< 0.5 mW total)
  • Single pixel per clock XGA (1024×768) ready
  • Supports VGA, SVGA, XGA and higher addressability.
  • Up to 227 Megabytes/sec bandwidth
  • Up to 1.8 Gbps throughput
  • Narrow bus reduces cable size and cost
  • 290 mV swing LVDS devices for low EMI
  • PLL requires no external components
  • Low profile 56-lead TSSOP package.
  • Also available in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package
  • Falling edge data strobe Receiver
  • Compatible with TIA/EIA-644 LVDS standard
  • ESD rating >7 kV
  • Operating Temperature: -40°C to +85°C
  • Description

    The DS90C383 transmitter converts 28 bits of LVCMOS/LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver converts the LVDS data streams back into 28 bits of LVCMOS/LVTTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge transmitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. Both devices are also offered in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package which provides a 44 % reduction in PCB footprint compared to the TSSOP package.

    This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.

    Also Recommended
    DS90C383BIn Production

    Part Number(s)
    (NSID)
    Top ViewAvailabilityCurrent Reported StockBudgetary PricingPack
    Size
    DS90C383MTD/NOPB

    DS90C383MTD

    RoHS Status


    TSSOP
    Not recommended for new designs
    (as of 18-Jun-07)
    Lead Time: 6 weeks

     
    DistributorRegionQty
    ARROWWorldwide117
    DIGI-KEYWorldwide30
    MOUSERWorldwide85
    TAYLORAmericas117
    $3.71 each at 1K+ pcsrail
    of
    34
    DS90C383MTDX/NOPB

    DS90C383MTDX

    RoHS Status


    TSSOP
    Not recommended for new designs
    (as of 18-Jun-07)
    Lead Time: 8 weeks

     
    DistributorRegionQty
    ARROWWorldwide1983
    AVNET-EMWorldwide1000
    DIGI-KEYWorldwide0
    TAYLORAmericas1983
    $3.71 each at 1K+ pcsreel
    of
    1000

    Obsolete Versions
    Obsolete PartAlternate Part or SupplierSourceLast Time Buy Date
    DS90C383AMTD
    NONE
    NONE
    31 Oct 2004
    DS90C383AMTDXL
    NONE
    NONE
    31 Oct 2004
    DS90C383SLC
    NONE
    NONE
    03 Mar 2004
    DS90C383SLCX
    NONE
    NONE
    03 Mar 2004

    All information pertaining to the RoHS Compliance Standard can be found at http://www.national.com/en/packaging/leadfree.html.

    Moisture Sensitivity Level Data for DS90C383.

    A RoHS compliance or an IPC 1752 report can be acquired at http://www.national.com/en/packaging/greennopb.html.

    National's certificate of product compliance for DS90C383 is located at RoHS Status.

    Part Number(s)
    (NSID)
    Weight
    (milligrams)
    TypePinsMSL RatingPeak ReflowRoHS
    Status
    CAD SymbolsModelsPackage
    Marking
    Format
    DS90C383MTD/NOPB

    DS90C383MTD
    222.11
    223
    TSSOP562
    2
    260
    235
    DetailN/A
    ibis file
    NS2ZXYTTE#
    DS90C383MTD
    BBBBB
    DS90C383MTDX/NOPB

    DS90C383MTDX
    222.11
    223
    TSSOP562
    2
    260
    235
    DetailN/AN/A
    NS2ZXYTTE#
    DS90C383MTD
    BBBBB

    All information pertaining to the RoHS Compliance Standard can be found at http://www.national.com/en/packaging/leadfree.html.

    Moisture Sensitivity Level Data for DS90C383.

    A RoHS compliance or an IPC 1752 report can be acquired at http://www.national.com/en/packaging/greennopb.html.

    National's certificate of product compliance for DS90C383 is located at RoHS Status.

    CAD Symbols and Models
    N/A
     Models

    ibis file


    Reliability Metrics
    Part Number Process EFR Reject EFR Sample Size PPM LTA Rejects LTA Device Hours FITS MTTF (Hours)
    DS90C383MTD.350202750015150003429885386
    DS90C383MTDX.350202750015150003429885386

    Note: The Early Failure Rates (EFR) were calculated as point estimate PPM based on rejects and sample size for EFR. The Long Term Failure Rates were calculated at 60% confidence using the Arrhenius equation at 0.7eV activation energy and derating the assumed stress temperature of 150°C to an application temperature of 55°C.

    For more information on Reliability Metrics, please click here.


    All information pertaining to the RoHS Compliance Standard can be found at http://www.national.com/en/packaging/leadfree.html.

    Moisture Sensitivity Level Data for DS90C383.

    A RoHS compliance or an IPC 1752 report can be acquired at http://www.national.com/en/packaging/greennopb.html.

    National's certificate of product compliance for DS90C383 is located at RoHS Status.

    Obsolete Versions
    Obsolete PartAlternate Part or SupplierSourceLast Time Buy Date
    DS90C383AMTD
    NONE
    NONE
    31 Oct 2004
    DS90C383AMTDXL
    NONE
    NONE
    31 Oct 2004
    DS90C383SLC
    NONE
    NONE
    03 Mar 2004
    DS90C383SLCX
    NONE
    NONE
    03 Mar 2004

    [Information as of 9-Feb-2012]