National Semiconductor | High-performance Analog


 CP3BT26   

Reprogrammable Connectivity Processor with Bluetooth, USB, and CAN Interfaces [Not recommended for new designs]
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Features

CPU Features

  • Fully static RISC processor core, capable of operating from 0 to 24 MHz with zero wait/hold states
  • Minimum 41.7 ns instruction cycle time with a 24-MHz internal clock frequency, based on a 12-MHz external input
  • 47 independently vectored peripheral interrupts
  • On-Chip Memory

  • 256K bytes reprogrammable Flash program memory
  • 8K bytes Flash data memory
  • 32K bytes of static RAM data memory
  • Addresses up to 12M bytes of external memory
  • Broad Range of Hardware Communications Peripherals

  • Bluetooth Lower Link Controller (LLC) including a shared 4.5K byte Bluetooth RAM and 1K byte Bluetooth Sequencer RAM
  • Universal Serial Bus (USB) 1.1 full-speed node
  • ACCESS.bus serial bus (compatible with Philips I2C bus)
  • CAN interface with 15 message buffers conforming to CAN specification 2.0B active
  • 8/16-bit SPI, Microwire/Plus serial interface
  • Four-channel Universal Asynchronous Receiver/Transmitter (UART), one channel has USART capability
  • Advanced Audio Interface (AAI) to connect to external 8/ 13-bit PCM Codecs as well as to ISDN-Controllers through the IOM-2 interface (slave only)
  • CVSD/PCM converter supporting one bidirectional audio connection
  • General-Purpose Hardware Peripherals

  • 12-bit A/D Converter (ADC)
  • Dual 16-bit Multi-Function Timer (MFT)
  • Versatile Timer Unit with four subsystems (VTU)
  • Four-channel DMA controller
  • Timing and Watchdog Unit
  • Random Number Generator peripheral
  • Extensive Power and Clock Management Support

  • On-chip Phase Locked Loop
  • Support for multiple clock options
  • Dual clock and reset
  • Power-down modes
  • Flexible I/O

  • Up to 54 general-purpose I/O pins (shared with on-chip peripheral I/O)
  • Programmable I/O pin characteristics: TRI-STATE output, push-pull output, weak pull-up input, high-impedance input
  • Schmitt triggers on general-purpose inputs
  • Multi-Input Wake-Up (MIWU) capability
  • Power Supply

  • I/O port operation at 2.5V to 3.3V
  • Core logic operation at 2.5V
  • On-chip power-on reset
  • Temperature Range

  • -40?C to +85?C (Industrial)
  • Packages

  • LQFP-128, LQFP-144
  • Complete Development Environment

  • Pre-integrated hardware and software support for rapid prototyping and production
  • Integrated environment
  • Project manager
  • Multi-file C source editor
  • High-level C source debugger
  • Comprehensive, integrated, one-stop technical support
  • Bluetooth Protocol Stack

  • Applications can interface to the high-level protocols or directly to the low-level Host Controller Interface (HCI)
  • Transport layer support allows HCI command-based interface over UART port
  • Baseband (Link Controller) hardware minimizes the bandwidth demand on the CPU
  • Link Manager (LM)
  • Logical Link Control and Adaptation Protocol (L2CAP)
  • Service Discovery Protocol (SDP)
  • RFCOMM Serial Port Emulation Protocol
  • All packet types, piconet, and scatternet functionality supported

    Description

    The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip SRAM and Flash memory provides high computing bandwidth, hardware communications peripherals provide high- I/O bandwidth, and an external bus provides system expandability.

    On-chip communications peripherals include: Bluetooth Lower Link Controller, CAN controllers, Microwire/Plus, SPI, ACCESS.bus, quad UART, 12-bit A/D converter, and Advanced Audio Interface (AAI). Additional on-chip peripherals include Random Number Generator (RNG), DMA controller, CVSD/PCM conversion module, Timing and Watchdog Unit, Versatile Timer Unit, Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

    Bluetooth hand-held devices can be both smaller and lower in cost for maximum consumer appeal. The low voltage and advanced power-saving modes achieve new design points in the trade-off between battery size and operating time for handheld and portable applications.

    In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3BT26 is backed up by the software resources designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with a Bluetooth radio transceiver such as Nationalis LMX5252, the CP3BT26 provides a complete Bluetooth system solution.

    National Semiconductor offers a complete and industryproven application development environment for CP3BT26 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth Protocol Stack, and Application Software.

  • Datasheets
    TitleSizeDateOther
    Language
    CP3BT26 Reprogrammable Connectivity Processor with Bluetooth, USB, and CAN Interfaces4072
    Kbytes
    27-Feb-07   

    Part Number(s)
    (NSID)
    Top ViewAvailabilityCurrent Reported StockBudgetary PricingPack
    Size
    CP3BT26G18AWM/NOPB


    RoHS Status


    LQFP
    Not recommended for new designs
    (as of 12-Mar-08)
    Lead Time: 12 weeks

     

    Contact your distributor
    CALLtray
    of
    N/A
    CP3BT26G18AWMX/NOPB


    RoHS Status


    LQFP
    Not recommended for new designs
    (as of 12-Mar-08)
    Lead Time: 12 weeks

     

    Contact your distributor
    CALLreel
    of
    N/A
    CP3BT26G18NEP

    RoHS Status


    LQFP
    Not recommended for new designs
    (as of 12-Mar-08)
    Lead Time: 12 weeks

     

    Contact your distributor
    $16.70 each at 1K+ pcstray
    of
    72
    CP3BT26G18NEPX

    RoHS Status


    LQFP
    Not recommended for new designs
    (as of 12-Mar-08)
    Lead Time: 12 weeks

     

    Contact your distributor
    $16.70 each at 1K+ pcsreel
    of
    500
    CP3BT26Y98NEP/NOPB


    RoHS Status


    LQFP
    Not recommended for new designs
    (as of 12-Mar-08)
    Lead Time: 16 weeks

     
    DistributorRegionQty
    DIGI-KEYWorldwide0
    $16.80 each at 1K+ pcstray
    of
    60

    Obsolete Versions
    Obsolete PartAlternate Part or SupplierSourceLast Time Buy Date
    CP3BT26G18AAKX
    NONE
    NATIONAL SEMICONDUCTOR
    16 Nov 2008
    CP3BT26Y98AADX
    NONE
    NATIONAL SEMICONDUCTOR
    16 Nov 2008
    CP3BT26Y98AAFX
    NONE
    NATIONAL SEMICONDUCTOR
    16 Nov 2008
    CP3BT26Y98NEPX
    NONE
    NATIONAL SEMICONDUCTOR
    16 Nov 2008

    All information pertaining to the RoHS Compliance Standard can be found at http://www.national.com/en/packaging/leadfree.html.

    Moisture Sensitivity Level Data for CP3BT26.

    A RoHS compliance or an IPC 1752 report can be acquired at http://www.national.com/en/packaging/greennopb.html.

    National's certificate of product compliance for CP3BT26 is located at RoHS Status.

    Part Number(s)
    (NSID)
    Weight
    (milligrams)
    TypePinsMSL RatingPeak ReflowRoHS
    Status
    CAD SymbolsModelsPackage
    Marking
    Format
    CP3BT26G18AWM/NOPB

    983.812
    LQFP1283260DetailN/AN/A
    NSUZXYYTTE#
    CP3BT26G18
    AWM
    CP3BT26G18AWMX/NOPB

    983.811
    LQFP1283260DetailN/AN/A
    NSUZXYYTTE#
    CP3BT26G18
    AWM
    CP3BT26G18NEP
    983.811
    986.002
    LQFP1283260DetailN/AN/A
    NSUZXYYTTE#
    CP3BT26G18NEP
    CP3BT26G18NEPX
    983.811
    986.002
    LQFP1283260DetailN/AN/A
    NSUZXYYTTE#
    CP3BT26G18NEP
    CP3BT26Y98NEP/NOPB

    1347.521
    LQFP1443260DetailN/AN/A
    NSUZXYYTTE#
    CP3BT26Y98NEP

    All information pertaining to the RoHS Compliance Standard can be found at http://www.national.com/en/packaging/leadfree.html.

    Moisture Sensitivity Level Data for CP3BT26.

    A RoHS compliance or an IPC 1752 report can be acquired at http://www.national.com/en/packaging/greennopb.html.

    National's certificate of product compliance for CP3BT26 is located at RoHS Status.

    CAD Symbols and Models
    N/A
     Models
    N/A


    Reliability Metrics
    Part Number Process EFR Reject EFR Sample Size PPM LTA Rejects LTA Device Hours FITS MTTF (Hours)
    CP3BT26G18AWMCMOS8T0167100017800002505079860
    CP3BT26G18AWMXCMOS8T0167100017800002505079860
    CP3BT26G18NEPCMOS8T0167100017800002505079860
    CP3BT26G18NEPXCMOS8T0167100017800002505079860
    CP3BT26Y98NEPCMOS8T0167100017800002505079860

    Note: The Early Failure Rates (EFR) were calculated as point estimate PPM based on rejects and sample size for EFR. The Long Term Failure Rates were calculated at 60% confidence using the Arrhenius equation at 0.7eV activation energy and derating the assumed stress temperature of 150°C to an application temperature of 55°C.

    For more information on Reliability Metrics, please click here.


    All information pertaining to the RoHS Compliance Standard can be found at http://www.national.com/en/packaging/leadfree.html.

    Moisture Sensitivity Level Data for CP3BT26.

    A RoHS compliance or an IPC 1752 report can be acquired at http://www.national.com/en/packaging/greennopb.html.

    National's certificate of product compliance for CP3BT26 is located at RoHS Status.

    Obsolete Versions
    Obsolete PartAlternate Part or SupplierSourceLast Time Buy Date
    CP3BT26G18AAKX
    NONE
    NATIONAL SEMICONDUCTOR
    16 Nov 2008
    CP3BT26Y98AADX
    NONE
    NATIONAL SEMICONDUCTOR
    16 Nov 2008
    CP3BT26Y98AAFX
    NONE
    NATIONAL SEMICONDUCTOR
    16 Nov 2008
    CP3BT26Y98NEPX
    NONE
    NATIONAL SEMICONDUCTOR
    16 Nov 2008

    [Information as of 9-Feb-2012]