Overview:
Component integration and the miniaturization of electronic assemblies enable manufacturers to create smaller, lighter, high performance products. Wire bond interconnect, whether implemented in the form of Chip-on-Board (COB) or multiple die assemblies, continues to be a critical technology in creating high performance and highly integrated systems.

From design to manufacture, understanding the central considerations in wire bond assemblies is key to assembly manufacturers creating competitive and robust processes, and successfully implementing this technology.
 
This seminar will discuss critical issues for reliable COB and multiple die assembly manufacturing, implementation in the SMT manufacturing environment, as well as general PCB / substrate layout and thermal considerations.

Presenter:
Mark McClintick is a Process Engineer with National Semiconductor's Die Products Group in South Portland, ME.

Topics:

• Manufacturing process considerations from "die attach" to "encapsulation"               
• Review mixed SMT device and multi-die manufacturing approaches               
• Design and thermal considerations

Who Should Attend?
Manufacturing engineers, project managers, operation managers, designers, strategic marketing personnel.

Prerequisites:
A basic understanding of semiconductor assembly processes.

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Transcript

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