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Overview:
 Handheld, portable and wireless products continue to be driven by the need for reduction in size and weight while at the same time meeting the demand for increased functionality and performance. Component integration and the miniaturization of the electronic assemblies enables manufacturers to create these smaller, lighter, high performance products. Die assemblies, whether implemented as chip-on-board or flip chip, provide the required system performance and integration advantages.
From design to manufacture, understanding the benefits and trade-offs of utilizing unpackaged semiconductor die is key to an assembly manufacturer's successful conversion from Surface Mount Technology to bare die assemblies.
This seminar will discuss the factors driving use of bare semiconductor die, various interconnection options, and considerations for implementing die assembly technology in the SMT manufacturing process.
Presenter:
Mark McClintick is a Process Engineer with National Semiconductor's Die Products Group in South Portland, ME.
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