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Lead Finish Composition/Thickness
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| Package Type |
Option |
Lead Finish Composition |
Lead Finish Plating Thickness |
| Leaded Packages |
Standard |
85% Sn, 15% Pb |
5.08 microns minimum |
| Pb-Free |
Matte Sn |
8 microns minimum, 12 microns nominal |
| LLP, TSOT |
Standard |
85% Sn, 15% Pb |
5.08 microns minimum |
| Pb-Free |
Matte Sn |
8 microns minimum, 12 microns nominal |
| NiPdAu |
0.53 microns minimum |
| TO-92 |
Standard |
85% Sn, 15% Pb |
5.08 microns minimum |
| Pb-Free |
99.3% Sn, 0.7% Cu |
15-20 microns (solder dipped) |
| Metal Can (TO-3, TO-5, TO-46) |
Standard |
63% Sn, 37% Pb |
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| Pb-Free |
96.5% Sn, 3.0% Ag, 0.5% Cu |
8 microns minimum (solder dipped) |
| Cerpak |
Standard |
63% Sn, 37% Pb |
5.08 microns minimum |
| Pb-Free |
96.5% Sn, 3.0% Ag, 0.5% Cu |
8 microns minimum |
| Package Type |
Option |
Lead Finish Composition |
| Micro SMD |
Standard |
63% Sn, 37% Pb |
| Pb-Free |
98.3% Sn, 1.2% Ag, 0.5% Cu or 95.5% Sn, 4.0% Ag, 0.5% Cu |
| Micro SMDxt |
Pb-Free |
96.5% Sn, 3.5% Ag |
| Ball Grid Array |
Standard |
63% Sn, 37% Pb |
| Pb-Free |
95.5% Sn, 4.0% Ag, 0.5% Cu |
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