| Package Name |
Package Codes |
Legacy Package Codes |
| Metal Leaded Chip Carrier, J Bend |
AA |
|
| MQUAD |
AW |
MQ |
| System in Package (SYSIP) |
BC |
|
| Micro SMD (Large Bumps) |
BL |
|
| Micro SMD (Small Bumps) |
BP |
|
| SIP |
CA |
C |
| Ceramic Column Grid Array (CCGA) |
CC |
|
| Chip On Flex (Column Driver) |
CF |
|
| Chip on Glass (Column Driver) |
CG |
|
| Tape Carrier Package (Column Driver) |
CT |
|
| Sidebrazed, Hermetic Dip (Metal Seal) |
DH |
D, DA |
| Micro SMD (Thin/Large Bumps/Redistribution Layer) |
DL |
|
| Leadless Chip Carrier (LCC) |
EA |
E |
| Embedded IC (0.4 mm pitch) |
EB |
|
| Embedded IC (0.5 mm pitch) |
EC |
|
| Leaded Hermetic Quad Packages |
EL |
|
| Ceramic Quad Gullwing Package (CQGP) |
EM |
|
| EQUAD |
EQ |
|
| Ceramic Flat Pack (Solder Seal) |
FA |
F |
| Flip Chip BGA |
FB |
|
| Flip Chip On Board |
FC |
|
| Microcoat (large bump) |
FL |
|
| Micro-Array, 0.8 mm thick |
GQ |
|
| Micro-Array, 1.0 mm thick |
GR |
|
| Metal Can, TO-5/39/46 |
HA |
H |
| CDIP |
JA |
J |
| Metal Can, Steel TO-3 |
KA |
K, KC, KS, |
| LLP MINI |
LB |
|
| LLP COL (Leadless Leadframe Package) |
LC |
|
| LLP (Leadless Leadframe Package)-DIP |
LD |
|
| LLP (Leadless Leadframe Package) |
LE |
|
| Power Leadless Leadframe Package (LLP) |
LP |
|
| LLP (Leadless Leadframe Package)-Quad |
LQ |
|
| LLP (Leadless Leadframe Package) Array |
LR |
|
| LMU (Light-Emitting Diode Management Unit) |
LZ |
|
| SOIC Narrow |
MA |
M |
| TSOP |
MB |
MBH,MBS,MDA,MDB |
| SSOP (300 mil wide) |
ME |
|
| SOT-23 |
MF |
M3,M5 |
| SC-70 |
MG |
M7 |
| TSSOP EXP PAD (Exposed Pad) |
MH |
MXA |
| Thin SOT-23 (TSOT) |
MK |
|
| Restricted - Military use only |
ML |
|
| MINI SOIC |
MM |
|
| SOT-23 EXP PAD (Exposed Pad) |
MN |
|
| SOT-223 |
MP |
|
| SSOP (150 mil wide) |
MQ |
MS,MSA,MSC,MQA,MEB,MEC,MED |
| Power SOP (exposed pad soic) |
MR |
|
| SSOP-EIAJ Type II and III |
MS |
|
| TSSOP (4.4 mm and 6.1 mm wide) |
MT |
|
| MINI SOIC EXP PAD (Exposed Pad) |
MV |
|
| SOIC Wide |
MW |
WM |
| MINI SOIC EXP PAD (Exposed Pad) |
MY |
|
| TSSOP EXP PAD (Exposed Pad) |
MZ |
|
| MDIP |
NA |
N |
| Micro SMDxt (0.5 mm pitch) |
RL |
|
| Micro SMDxt (0.4 mm pitch) |
RM |
|
| LTCC with castilations |
SA |
|
| LTCC with Solder Balls |
SB |
|
| LTCC with Clip on Leads |
SC |
|
| LLP no pullback, dual, 0.8mm thick |
SD |
|
| POS (Package on Substrate) |
SE |
|
| UFBGA (0.4 mm pitch only) |
SF |
|
| Optical CSP w/ Glass Lid |
SG |
|
| Laminate CSP, TCSP and UCSP (w/ land area contacts) |
SL |
SLB |
| FBGA |
SM |
SLC |
| TFBGA |
|
|
| UFBGA |
|
|
| LLP no pullback, 0.4mm thick |
SN |
|
| LLP no pullback, 0.6mm thick |
SP |
|
| LLP no pullback, quad, 0.8mm thick |
SQ |
|
| LLP no pullback, 1.0mm thick |
SR |
|
| LLP no pullback, 1.0mm thick, half-etched DAP |
SU |
|
| SolarMagic™ Power Optimizers |
SZ |
|
| TO-220 |
TA |
T |
| TO-247, Through Hole |
TB |
|
| TO-252 (DPAK) |
TD |
DT |
| TO-220 (High Voltage) |
TE |
|
| TO-220-ISO |
TF |
|
| TO-263 THIN, Surface Mount |
TJ |
|
| Micro SMD (Thin/Large Bumps) |
TL |
|
| Micro SMD (Thin/0.4 mm pitch) |
TM |
|
| Micro SMD (Thin/Small Bumps) |
TP |
|
| Micro SMD (Thin/Printed bump on large UBM) |
TR |
|
| TO-263, Surface Mount |
TS |
S |
| TO-PMOD |
TZ |
|
| EBGA (Enhanced BGA) |
UA |
|
| SBGA(Super BGA) |
UB |
|
| PBGA (Plastic) |
UC |
U(X,X) |
| TBGA (Tape) |
UD |
|
| CPGA (Ceramic Pin Grid Array) |
UE |
U |
| LBGA (Low Profile BGA) |
UF |
|
| TSBGA(Tape Super BGA) |
UG |
|
| PPGA (Plastic Pin Grid Array) |
UH |
|
| Micro SMD (Ultra Thin/Large Bumps) |
UL |
|
| Micro SMD (Ultra Thin/0.4 mm pitch) |
UM |
|
| Micro SMD (Ultra Thin/Small Bumps) |
UP |
|
| Micro SMD (Ultra Thin/Printed bump on large UBM) |
UR |
|
| TE-PBGA(Thermally Enhanced PBGA) |
UT |
|
| PLCC |
VA |
V |
| PQFP (t=3.8mm, pitch=0.5 mm) |
VB |
|
| PQFP (t=2.0mm, pitch=0.5) |
VC |
V(X,X) |
| PQFP (t=2.0mm, pitch=0.65) |
VD |
V(X,X) |
| PQFP (t=2.0mm, pitch=0.8) |
VE |
V(X,X) |
| PQFP (t=2.0mm, pitch=1.0) |
VF |
V(X,X) |
| PQFP (t=3.8mm, pitch=0.65 mm) |
VG |
|
| PQFP (t=2.7mm, pitch=0.5) |
VH |
V(X,X) |
| PQFP (t=2.7mm, pitch=0.65) |
VI |
V(X,X) |
| PQFP (t=2.7mm, pitch=0.8) |
VJ |
V(X,X) |
| PQFP (t=2.7mm, pitch=1.0) |
VK |
V(X,X) |
| PQFP (t=3.4mm, pitch=0.5) |
VM |
V(X,X) |
| PQFP (t=3.4mm, pitch=0.65) |
VN |
V(X,X) |
| PQFP (t=3.4mm, pitch=0.8) |
VO |
V(X,X) |
| PQFP (t=3.4mm, pitch=1.0) |
VP |
V(X,X) |
| TQFP (t=1.0mm, pitch=0.4 mm) |
VQ |
|
| TQFP (t=1.0mm, pitch=0.5) |
VS |
V(X,X) |
| TQFP (t=1.0mm, pitch=0.65) |
VT |
V(X,X) |
| TQFP (t=1.0mm, pitch=0.8) |
VU |
V(X,X) |
| LQFP (t=1.4mm, pitch=0.5) |
VV |
V(X,X) |
| LQFP (t=1.4mm, pitch=0.65) |
VW |
V(X,X) |
| LQFP (t=1.4mm, pitch=0.8) |
VY |
V(X,X) |
| Cerpack |
WA |
W |
| Ceramic SOIC |
WG |
|
| MICROFIL, 64 BUMPS (Large) |
WL |
|
| MICROFIL, 64 BUMPS (Small) |
WP |
|
| Cerquad |
WQ |
W |
| Micro SMD (Extreme Thin) |
XP |
|
| Micro SMD (Extreme Thin/Printed bump on large UBM) |
XR |
|
| TQFP EXP PAD (Exposed Pad) |
YA |
|
| LQFP EXP PAD (Exposed Pad) |
YB |
|
| LLP, s/b or thick plate, 0.8mm, dual |
YD |
|
| LLP, solder bump or thick plate, 0.6mm |
YP |
|
| LLP, s/b or thick plate, 0.8mm, quad |
YQ |
|
| LLP, solder bump or thick plate, 1.0mm |
YR |
|
| TO-92 |
ZA |
Z,R |
