LLP Chip Scale Package
- High PCB density 0.8 mm max. package height
- 8-Pin dual-in-line to 44-Pin quad configuration
- 0.5 mm - 0.8 mm lead pitch (depending on lead count)
- Inherent coplanarity
- Soldering exposed die attach pad to PCB offers optimal thermal performance, enhances package self-alignment to PCB during reflow.
- Uses standard SMT placement and reflow equipment
- Negligible package lead inductance for faster signal response, less cross talk, and ground bounce
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Reliability
- Passes all standard product reliability tests:
- OPL, THBT, Temp cycle, Autoclave, and ESD
- Passes all standard board level reliability tests:
- Drop, Vibration, and 3-point bend
- Meets JEDEC moisture sensitivity level 1
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