Packaging Technology

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Selection Guide & Mechanical Package Drawings

Packaging Resources

Additional Resources

PCB Design	Packing Information	Manufacturing Considerations	Performance	Other Information
CAD Symbols LLP Footprints (Gerber Format) Land Pattern Recommendations	Packing Considerations Surface Mount Tape & Reel Dimensions TO-92 Packing Options / Ordering Instructions	Advanced Packaging Technology–Assembly Lead Finish Composition/Thickness Moisture-Induced Cracking Absolute Maximum Ratings for Soldering Mounting of Surface Mount Components Process Recommendations Handling & Process Recommendations (pdf) Solder Ball Composition	Electrical Performance of Packages Package Thermal Characterization Understanding IC Package Power Capabilities	TO-220 Leadbend Options Die & Wafer Products

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TI Product Information Center (TI's email/phone support hotline for your region of the world)

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