National's Enhanced Solutions has introduced a Ceramic SOIC package which offers a hermetic Surface Mount Package with Gull Wings leads. The portfolio of fully qualified products is shown below.
Features and Benefits
SOIC Vs. DIP
Emulates JEDEC standard for wide body (300mil) SOICs
37% smaller footprint than ceramic DIP
61% profile reduction
80% weight reduction*
Surface mount technology
10, 14, 16 & 20 leads packages available
Excellent thermal characteristics for heat sensitive applications
* typical value - actual reduction varies by package and die type
