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A wide variety of die assembly methods and materials are available for implementation into high yield, high reliability systems. Some of the options for die seal and encapsulation are reviewed here for comparison.
Hermetic – Seam Seal
Advantages: hermetic, low temperature, large seal area, low profile, minimal floor space requirements
Disadvantages: low throughput
Process Considerations: dry box environment, electrode design, lid design
Non-Hermetic – Glob Top
Advantages: flexible, low temperature, low stress, low profile
Disadvantages: non-hermetic, limited protection, spread, wire wash potential
Process Considerations: dispensing parameters, viscosity, dams, cure |
