National Semiconductor's environmental program is defined by commitments to continually reducing our environmental footprint through efficient use of resources and emission reduction; complying with applicable laws, regulations and company standards and our ISO 14001:2004 certified environmental management systems.
Resource Use
 National is focused on energy efficiency, with both our products and operations. We are a leader in energy efficient power management integrated circuits, epitomized by our PowerWise® and SolarMagic® products.
Our manufacturing operations have reduced energy use by 33% since 2005 through energy conservation activities. In South Portland, Maine, National is combining a $300,000 grant from Efficiency Maine—its largest ever single grant allocation—with National's own $750,000 investment to replace its fab tool chillers with high efficiency, solid state units—a project expected to save 1.75 million kW-hrs per year in energy use as well as reduce greenhouse gas emissions from conventional refrigerants. At our assembly plant in Melaka, Malaysia, a switch to new energy efficient lighting is providing an annual average savings of 1.28 million kW-hr. At National's fab in the United Kingdom, replacement of the site's water chiller, installation of variable speed drives on its facilities systems, innovative utilities monitoring techniques, and engagement with site employees on conservation opportunities have helped to achieve a 21% year-over-year reduction. Finally, in National's Santa Clara, CA headquarters, most cooling towers and air handling units are being replaced with more efficient units, which will result in a savings of approximately 120,000 kW-hrs per year.
 Additionally, water use has been reduced by 23% across the company. Management of site water balances, increased efficiencies in generation of ultrapure water (UPW), and process improvements to reduce the number of wafer rinses have all contributed to water conservation efforts. For example, our UK fab reduced its annual water usage by nearly 80,000 cubic meters through reduction of idle flows on wet benches. In addition, water reuse rates are as high as 25% in our production facilities.
We fully expect our focus on manufacturing efficiency will continue to yield significant reductions in the use of resources in the future.
 Industry standard packing materials used by National are either recyclable or reusable, with a few minor exceptions such as dry-pack bags. Corrugated cardboard packing materials contain 70% recycled content. Packing materials used by National do not contain heavy metals or other banned materials, nor do they contain PVC, with the exception of industry standard rails, also known as tubes and sticks. National does not take back packing material, but it participates in packaging recycling consortia.
Waste & Recycling
All of National's sites have their own programs for solid waste handling and recycling from offices, production facilities, and packaging. For example, in Santa Clara, CA, all paper and cardboard waste is recycled, and metal waste is reclaimed. Glass, aluminum, and plastic waste is donated, and universal waste such as batteries, lamps, and CRTs are also donated or recycled per applicable hazardous waste regulations. For the 1st ten months in 2009, the site has also recycled or donated more than 62 tons of computer equipment. Food containers have been switched to compostable material, and semiannual e-waste collection events are held for employees.
At our Malaysia site, over 200 tons of computer e-waste, scrap integrated circuits and leadframes, and other materials associated with chip assembly are recycled annually for metal recovery. Over 170 tons of cardboard and mixed paper and over 10 tons of plastics associated with packaging are recycled as well.
Finally, in our fabs such as in the UK, separate programs for office areas, fab waste, and packaging oversee the recycling of a wide range of articles including waste paper, beverage containers, and cardboard and plastic packaging.
Moreover, National's front-end manufacturing facilities process—and reclaim—used silicon wafers. Wafers are salvaged through both internal reclaim processes as well as through the use of external wafer reclaim service providers. The wafers are then reused in the factory as monitor or test wafers.
Climate Change
 Improved manufacturing efficiency also reduces greenhouse gas emissions. Our greenhouse gas emissions result from our use of energy and perfluorocompounds (PFCs), which are essential in the manufacture of semiconductors but have strong global warming properties. In 2008 we set a five year goal to reduce greenhouse gas emissions from our manufacturing plants by 40% from a 2005 baseline. So far, emissions are down 33% through energy conservation and PFC optimization.
 National's Maine facility is reducing its direct CO2 emissions from pollution abatement systems by 75% through cooperation with regulatory agencies and purchase of more efficient equipment. At its Santa Clara campus, National participates in Silicon Valley Power's (SVP) clean renewable energy program, Santa Clara Green Power. Derived from clean wind and solar generation sources, National's renewable power commitment procures 1.6 million kilowatt-hours annually for the Santa Clara campus.
Pollution Prevention and Control
 Semiconductor manufacturing processes use a number of acids, bases, solvents and gases. We have state-of-art chemical management, containment, detection and abatement systems to prevent releases of hazardous chemicals and to protect employees, surrounding communities and the environment. Strict procedures are in place for the safe storage, handling and use of chemicals. Employees are trained on these systems and procedures as well as regulatory requirements. Emergency response teams are in place and trained in chemical spill response.
 Air and water pollution control systems are designed and operated to meet regulatory requirements. Wastewater from our wafer fabrication plants is treated to control pH within the range specified by local regulations. In addition to pH control, assembly plants treat wastewater to remove heavy metals from plating operations prior to discharge. Our plants have all necessary air pollution control systems, including thermal destruction units to abate organic emissions, water scrubbers to remove acidic gases and ammonia and process specific emission control devices.
We have a history of proactively eliminating hazardous chemicals from our operations, beginning with the elimination of trichloroethylene in the 1970s. We do not use chlorinated solvents, and we phased out ozone depleting substances between 1989 and 1993. In the 1990s we eliminated ethylene glycol ethers and methanol. While small quantities of perfluorooctane sulfonate (PFOS) are still used in photolithography processes where there are no substitutes, its use has been otherwise eliminated as well.
Since 2005, National's generation of hazardous waste has decreased by 37%, and we are currently modifying processes to further reduce solvent, fluoride and plating waste. For example, our facility in South Portland, Maine is reducing solvent use in resist strip processes by replacing it with water and dilute acid. In Malaysia, National reduced its shipment of acid waste by nearly 500 tons in 2009—more than an 80% reduction—through investment in a vacuum evaporation process. Moreover, National recycles its hazardous waste streams where feasible, such as using solvent waste for fuel blending. In addition, our hazardous waste is only shipped to hazardous waste disposal and treatment facilities that are licensed or permitted by applicable regulatory agencies and conform to our hazardous waste management standards. These hazardous waste sites are audited by National Semiconductor or 3rd party auditors prior to use and every three years thereafter. Hazardous waste facilities with significant audit findings are not used.
Groundwater & Soil Protection
 To protect groundwater and soil at our facilities from contamination, equipment, tanks, storage areas and piping containing hazardous materials are in secondary containment. Manufacturing plants are periodically monitored to detect groundwater contamination.
We are actively cleaning up legacy groundwater contamination at four sites in California, Maine and Washington and have completed the clean-up of a site in New York. Spills and leaks of solvents and petroleum products occurred at these sites in the 1960s, 1970s and early 1980s. Our Santa Clara, California facility is a Federal Superfund Site and is being cleaned up in cooperation with US EPA and the California Regional Water Quality Control Board. We assumed responsibility for clean-ups at the other sites through acquisitions. Financial reserves are maintained to fund all clean-ups.
We are constantly searching for innovative technologies to improve and speed-up clean-ups. We are operating innovative ozone and hydrogen peroxide injection systems and testing anaerobic bioremediation. Until these newer technologies are fully proven and implemented, we continue to use conventional groundwater pump and treat technology. |
