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EOS/ESD INFORMATION

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 Oxide Rupture: Sources   "Where did it come from"
Humans  Description  Investigate
Handling by un-grounded personnel
  • Insufficient training or certificate program
  • Uncontrolled work flows / processes
  • Current procedures or practices not ESD compliant
Machine Design PCB design and layout with ESD suppression
Improperly grounded equipment
  • All components contacting IC or PCBs must be conductive and connected to ground
  • All components contacting IC or PCBs must be conductive and equi-potential to ground (ie. Phenolic spacers in a handler; Suspect any non-metallic piece
  • Soldering Irons (ie. Too high resistance of tip to ground; Three prong electrical plug)
Field Inductance or EMI Arcing; CRT related items; Electric motors; Microwave sources, RF sources
Environment
Weather Lightning strikes;
Low humidity (<40RH)
Triboelectric materials Non-conductive table tops, wall panels, floor. Packing & transport materials. Styrofoam coffee cups.
Resistive ground references ESD ground common with facility ground
Manufacturing defects
Inherent design weakness circuit design; layout
Oxide defects particulates; layer thicknesses
 

Return to Cause and Effect menu   Go to the Effects section Go to the Causes section Currently in the Sources section Go to the Methods of Investigation section