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| EOS/ESD INFORMATION |
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| Metal and Poly Damage: Sources | ||
| Humans | Description | Investigate |
| Mis-orientation of IC | Monitor for compliance to correct procedures | |
| Inadvertent application of voltage | Check line test history for voltage surges or sustained high current sources | |
| Machine | Mis-orientation of IC | Determine and monitor assembly process |
| Inadvertent application of voltage | Check for unregulated or faulty power supplies | |
| Environment | ||
| Lightning strike, power supply surge/transient | Device and application exposure to lightning and/or power supply transients during test or assembly | |
| Latch-up condition | Application and test procedures | |
| Manufacturing defects | ||
| Metallization or polysilicon thinning | Requires die-level investigation, i.e. component failure analysis | |
