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EOS/ESD INFORMATION

Return to Cause and Effect menu   Go to the Effects section Go to the Causes section Go to the Sources section Currently in the Methods of Investigation section

 Metal and Poly Damage: Methods for Investigation
Look first   Description   Investigate
Quantify scope/size of problem Is it a sporadic occurrence?
Does it happen on a recurring basis?
Does it appear to be "batch" related?
Most likely problem areas
    Electrical Test:
  • Over-voltage
  • Voltage spikes
  • Power sequencing
    Board or System Assembly:
  • Mis-orientation of IC, subassembly, or cabling
  • Hot-switching
Also see the Junction Damage section.
Didn't find anything.
Now what?
ESD Survey
  • ESD audit using spec: EIA 625
  • Humidity survey (>40%RH)
  • Grounding (human and machine)
  • Packing materials
  • Remove non-essential ESD-generating material
  • ESD or static field sources
  • Check application for inductors in proximity
  • Supply line monitors
Found something. Now what?
Address any findings resulting from ESD survey or process review

Return to Cause and Effect menu   Go to the Effects section Go to the Causes section Go to the Sources section Currently in the Methods of Investigation section