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| EOS/ESD INFORMATION |
| Junction Damage: Sources (What generated the voltage spike?) | |||
| Humans | Description | Investigate | |
| Handling by un-grounded personnel |
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| Machine | Design | PCB design and layout with ESD suppression | |
| Improperly grounded |
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| Ground bounce sources | Switching relays | ||
| Field Inductance or EMI | Arcing; CRT related items; Electric motors; Microwave sources, RF sources | ||
| Cleanliness of raw power supply | |||
| Noisy supply from external supplier | Monitor Electric utility | ||
| Network load variations | Ground bounce sources; Voltage Supply harmonics; Switching relays | ||
| Environment | |||
| Weather | Lightning strikes; Low humidity (<40RH) | ||
| Triboelectric materials | Non-conductive table tops, wall panels, floor. Packing & transport materials. Styrofoam coffee cups. | ||
| Resistive ground references | ESD ground common with facility ground | ||
| Manufacturing defects | |||
| Inherent design weakness | circuit design; layout | ||
| Silicon defect | crystalline; particulates | ||