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Frequently Asked Questions
This page contains answers to common questions handled by our support
staff, along with some tips and tricks that we have found useful and presented here as
questions.
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How much voltage am I looking for when I suspect I have an ESD or EOS problem ?
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What is the difference between ESD and EOS?
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After my device is mounted on a board or in a system, can ESD really
affect my devices?
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Where does ESD come from?
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Why was my device destroyed by a voltage transient?
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Where can I get self-paced training on
ESD?
See Causes for the type of damage you are experiencing. (Causes and
Effects)
EOS causes damage or discoloration that is usually visible at the die surface.
Open and shorts are common electrical signatures. EOS is generated from continuous power sources.
ESD will cause damage that usually requires die level analysis and can cause leakage currents or
functional failures. ESD is generated by high field potential, through
'charge-and-discharge' events.
Yes. For example, the board terminations can be considered as extensions of the IC terminations, i.e., leads.
In addition, supply and ground leads on boards are connected to all devices on a board. Static fields from which
ESD evolves can form on any surface, not just ICs. Shunting of board connections and ensuring 'ESD safe' work
stations and equipment are some methods for reducing ESD exposure.
The 'potential' for ESD is everywhere. However, most likely suspects would include: conveyor belts,
pick-and-place equipment, test handlers, 'de-taping' systems, soldering irons, and human sources.
The devices are supposed to be 'good' to 2000v
ESD.
There are on-line resources that fill this need. Take a look at
on our links page under Semtronics.
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