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EOS/ESD INFORMATION

Return to Cause and Effect menu   Go to the Effects section Go to the Causes section Go to the Sources section Currently in the Methods of Investigation section

 Melted Bond Wire: Methods for Investigation
Look first  Description  Investigate
Quantify scope/size of problem Is it a sporadic occurrence?
Does it happen on a recurring basis?
Does it appear to be "batch" related?
Most likely problem areas Is there adequate ESD training?
Are ESD control components maintained?
Are there unwanted voltage spikes in Electrical Test?
Are the machines properly grounded?
Did any of the following occur?
  • Non-standard process handling (ie. re-work, off-line sampling)
  • Process or material changes prior to recent events (ie. ESD component or raw material changes; Power disruptions to plant or assembly line)
Didn't find anything.
Now what?
ESD Survey
  • ESD audit using spec: EIA 625
  • Humidity survey (>40%RH)
  • Grounding (human and machine)
  • Packing materials
  • Remove non-essential ESD-generating material
  • ESD or static field sources
  • Check application for inductors in proximity
  • Supply line monitors
Found something. Now what?
Address any findings resulting from ESD survey or process review