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Seminar Description
Handheld, portable and wireless products continue to be driven by the need for reduction in size and weight while at the same time meeting the demand for increased functionality and performance. Component integration and the miniaturization of the electronic assemblies enables manufacturers to create these smaller, lighter, high performance products. Die solutions, whether implemented as chip-on-board or flip chip, and high density substrates provide system performance and integration advantages. From design to manufacture, understanding the benefits and trade-offs of utilizing unpackaged semiconductor die and high performance substrates will result in maximized system solutions. This half-day seminar focuses on the use of semiconductor die, the materials directly associated with the manufacture of multi-die assemblies and specific applications. The presenters analyze the current trends dictating the use of unpackaged semiconductors, the processing of the die at the supplier and the use of performance substrates to enable development of multi-die assemblies. Issues related to the specifications of die products, the processing, key materials, implementation of die, and substrate options are addressed. Specific applications utilizing die for integration improvements compared to standard packaging options will be presented. Particular attention will be given to die preparation, chip-on-board processing and assembly manufacturing pitfalls. In this seminar references will be made to standard industry practices without detailed background explanations of basic principles; therefore attendees should have a basic understanding of semiconductor supply and die assembly. This seminar is suggested for engineers and engineering managers.
Agenda
- Session 1: Technology trends and die implementation
- Session 2: LTCC substrate technology for COB and flip chip applications
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Mr. Mark McClintick is a process engineer for National Semiconductor. Mark has 15 years experience in package assembly including multi-chip modules. He has a BA degree in Theology from Berkshire Christian College of Massachusetts and holds one patent.
Mr. Mike Ehlert is the Engineering Manager for National Semiconductor's LTCC foundry. He is a 30 year veteran of the ceramics industry with two patents and numerous papers and industry presentations to his credit. Mike holds a BS degree in Mechanical Engineering from San Jose State University.
Contact:
Fay Small, National Semiconductor Corporation
5 Foden Road M/S 01 34
South Portland, Maine USA 04106
Ph. 207 541 8249 (US)
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