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We know our success and prosperity are dependent upon how well our customers are serviced. Ultimately, the rewards are shared from improved products and services through the trust and loyalty shown by our customers.
The model that National Semiconductor has selected is QS9000, which integrates aspects of ISO9001.
We hope this information provides you with a useful introduction to National Semiconductor's Quality System. A more detailed description is contained in our
Introduction
Complex systems, such as semiconductor design and manufacturing, include numerous business and manufacturing processes involving both people and equipment. These processes must interact effectively to achieve customer satisfaction. It is important to understand that a system will achieve its objectives only if the activities of its sub-systems are linked and mutually supportive. It is National Semiconductor's objective to provide a competitive advantage to our customers worldwide. Customer inputs from scorecards, surveys, product and service quality results; provide the best measure of the effectiveness of our quality system. Utilizing these inputs, we have developed and implemented a Quality System that:
- Strives for customer satisfaction
- Driven by Management Commitment
- Promotes continuous improvement
- Links all of the business and manufacturing processes
- Is founded on teamwork and empowerment
- Institutionalizes use of common approaches and tools at all levels
- Encourages employee development and training
Quality System Definition - A system that outlines how you will improve and control all of your processes (that will ultimately lead to improved business performance).
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Reliability
National Semiconductor Corporation strives to achieve best-in-class quality and reliability performance on all their products through a systematic approach that emphasizes quality at every phase of product development through manufacturing. From initial design conception to fabrication, test, and assembly; quality is built-in and assured through stringent SPC monitoring of fabrication and assembly processes, materials inspections, wafer level reliability (WLR), new product qualifications, reliability monitoring of finished product and strict change control management.
New products at National Semiconductor are subject to the qualification requirements of the "Corporate New Product Reliability Qualification Requirements" specification, which assures that products meet reliability standards prior to their production release.
National Semiconductor monitors the reliability of finished products via the Reliability Monitoring Program (RMP) which runs periodically in our Melaka, Malaysia, and Singapore production facilities. A matrix of products representing key wafer fabrication processes and sites and assembly processes and sites, as well as subcontractors, is periodically sampled and subjected to a full range of accelerated reliability stress tests. The primary RMP stress tests utilized are Operating Life Tests (OPL), Temperature Humidity Bias Tests (THBT), Autoclave (ACLV) and Temperature Cycling (TMCL). Data from LTA OPL testing is utilized to track the Early Failure Rate (EFR) and Long Term Failure Rate (FITS).
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Internal Assessment
The Quality System organization is responsible for conducting periodic internal quality system assessments of internal groups/organizations and subcontractors. These assessments are used to measure compliance to stated requirements and the effective operation of the quality system. The published results provide for the identification of opportunities for continuous improvement. Each manufacturing location and product development center has a local Quality System group, which is responsible for internal assessment at their location.
Assessments are scheduled according to system performance and are performed by qualified personnel independent of the area being assessed. Results of assessments are documented and corrective actions are verified to ensure they are effective. Assessment results form part of the management review.
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Metrics - Reliability
Click here for Reliability Metrics.
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Advanced Statistical Methods
National Semiconductor has used Statistical Process Control (SPC) techniques along with tools such as Measurement System Analysis (MSA) and Design of Experiments (DOE) since 1982 to optimize processes throughout the corporation. In the manufacturing environment Statistical Methods are used to determine the capabilities of all processes and equipment. The use of Statistical Methods has become an inherent part of all business practices including:
- New Product Introduction
- Design and Development
- Product Qualification and Characterization
- Package Development and Characterization
- Process Transfers
- Process Changes
- Supplier and Subcontract Management
Other tools such as Failure Mode Effect Analysis (FMEA) in design and Control Plans in processes are used in a proactive manner to prevent problems from occurring. If problems do occur, team oriented problem solving techniques, such at the 8D Process, are widely used to analyze the problem and provide corrective actions at the root cause level. These same principles are also used to manage suppliers and subcontractors.
Comprehensive training in the use of statistical tools is offered to all employees to help promulgate the use of Statistical Methods throughout the corporation. Suppliers are also encouraged to participate in these educational efforts. Courses are structured with longer courses on general methods as well as shorter courses focused on specific competencies in variation reduction and process control. These courses ensure that the importance of recognizing and controlling process variation becomes a continuing part of the organization mindset.
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Traceability Systems
- Backward traceability to die run number based on part marking
- Forward traceability to Customer based on manufacturing details
- Root causes can be identified quickly, down to responsible process step: e.g. Machine, Operator, etc.
- Extent of problem can be determined accurately, narrowing the impact to only affected Lots / Customers
- Efficient containment plan can be implemented.
- Impact is reduced by timely, accurate Problem Notification
- Corrective action made possible by knowledge of ROOT CAUSE
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Advanced Ship to Stock
Advanced Ship-to-Stock program provides the following improvements in comparison to the previous Ship-to-Stock concept:
Improvements:
- Ship-To-Stock identification on PO is not necessary.
- No insistence on formal STS Agreement.
- Customer's Qualification effort reduced.
Concept:
Details of the Advanced Ship-to-Stock concept can be summarized as:
- All products qualified by National, for shipment to Customers are of Ship-to-Stock quality; due to the high level of quality achieved in our internal processes.
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