Solder Composition and Solder Thickness Information Home->Packaging Information

Solder Composition and Solder Thickness Information

Package Type Option Solder Composition Solder Plating Thickness
Leaded Packages Standard 85% Sn, 15% Pb 5.08 microns minimum
Pb-Free Matte Sn 8 microns minimum,
12 microns nominal
LLP, TSOT Standard 85% Sn, 15% Pb 5.08 microns minimum
Pb-Free Matte Sn 8 microns minimum,
12 microns nominal
NiPdAu 0.53 microns minimum
TO-92 Standard 85% Sn, 15% Pb 5.08 microns minimum
Pb-Free 99.3% Sn, 0.7% Cu 15-20 microns
(solder dipped)
Micro SMD Standard 63% Sn, 37% Pb N/A
Pb-Free 98.3% Sn, 1.2% Ag, 0.5% Cu
or 95.5% Sn, 4.0% Ag, 0.5% Cu
Ball Grid Array Standard 63% Sn, 37% Pb N/A
Pb-Free 95.5% Sn, 4.0% Ag, 0.5% Cu
Metal Can (TO-3, TO-5, TO-46) Standard 63% Sn, 37% Pb  
Pb-Free 96.5% Sn, 3.0% Ag, 0.5% Cu 8 microns minimum
(solder dipped)
Cerpak Standard 63% Sn, 37% Pb 5.08 microns minimum
Pb-Free 96.5% Sn, 3.0% Ag, 0.5% Cu 8 microns minimum
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