| Package Name |
Package Codes |
| Metal Leaded Chip Carrier, J Bend |
AA |
| MQUAD |
AW, MO |
| MicroSMD |
BP |
| SIP |
CA, C |
| Sidebrazed, Hermetic Dip (Metal Seal) |
DH, D, DA |
| Leadless Chip Carrier (LCC) |
EA, E |
| Leaded Hermetic Quad Packages |
EL |
| Ceramic Flat Pack (Solder Seal) |
FA, F |
| Dual Leadless Leadframe Package (LLP) |
LD |
| Quad Leadless Leadframe Package (LLP) |
LQ |
| Metal Can, TO-5/39/46 |
HA, H |
| CDIP |
JA, J |
| Metal Can, Steel TO-3 |
KA, K, KC, KS |
| SO Narrow |
MA, M |
| TSOP |
MB, MBH, MBS, MDA, MDB |
| SSOP (300 mil wide) |
ME |
| SOT23 |
MF, M3, M5 |
| SC70 |
MG, M7 |
| TSSOP Exposed Pad |
MH, MXA |
| SOIC-Mini |
MM |
| SOT223 |
MP |
| SSOP (150 mil wide) |
MQ, MS, MSA, MSC, MQA, MEB, MEC, MED |
| SSOP-EIAJ Type II and III |
MS |
| TSSOP (4.4 mm and 6.1 mm wide) |
MT |
| SO Wide |
MW, WM |
| MDIP |
NA, N |
| LTCC with castilations |
SA |
| LTCC with Solder Balls |
SB |
| LTCC with Clip on Leads |
SC |
| LTCC with Land Contacts |
SD |
| Laminate CSP w/ land area contacts |
SL, SLB |
| FBGA (flex BGA) |
SM, SLC |
| TO220 |
TA, T |
| TO202 |
TB, P, PA |
| TO-252 (DPAK) |
TD, DT |
| TO220-ISO |
TF |
| TO263 |
TS, S |
| EBGA (Enhanced BGA) |
UA |
| SBGA(Super BGA) |
UB |
| PBGA (Plastic) |
UC, U(X,X) |
| TBGA (Tape) |
UD |
| CPGA (Ceramic Pin Grid Array) |
UE, U |
| PPGA (Plastic Pin Grid Array) |
UP |
| PLCC |
VA, V |
| PQFP (t=2.0mm, pitch=0.5) |
VC, V(X,X) |
| PQFP (t=2.0mm, pitch=0.65) |
VD, V(X,X) |
|
PQFP (t=2.0mm, pitch=0.8)
|
VE, V(X,X) |
| PQFP (t=2.0mm, pitch=1.0) |
VF, V(X,X) |
| PQFP (t=2.7mm, pitch=0.5) |
VH, V(X,X) |
| PQFP (t=2.7mm, pitch=0.65) |
VI, V(X,X) |
| PQFP (t=2.7mm, pitch=0.8) |
VJ, V(X,X) |
| PQFP (t=2.7mm, pitch=1.0) |
VK, V(X,X) |
| PQFP (t=3.4mm, pitch=0.5) |
VM, V(X,X) |
| PQFP (t=3.4mm, pitch=0.65) |
VN, V(X,X) |
| PQFP (t=3.4mm, pitch=0.8) |
VO, V(X,X) |
| PQFP (t=3.4mm, pitch=1.0) |
VP, V(X,X) |
| TQFP (t=1.0mm, pitch=0.5) |
VS, V(X,X) |
| TQFP (t=1.0mm, pitch=0.65) |
VT, V(X,X) |
| TQFP (t=1.0mm, pitch=0.8) |
VU, V(X,X) |
| LQFP (t=1.4mm, pitch=0.5) |
VV, V(X,X) |
| LQFP (t=1.4mm, pitch=0.65) |
VW, V(X,X) |
| LQFP (t=1.4mm, pitch=0.8) |
VY, V(X,X) |
| Cerpack |
WA, W |
| Cerquad |
WQ, W |
| Ceramic SOIC |
WG |
| TQFP Exposed Pad |
YA |
| TO92 |
ZA, Z, R |
|
 |
|
For more information on all events, visit our events page.
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