National Semiconductor Corp. - Lead-free Related Publications

Packaging | Lead-Free Status | Impact to Customers | Tin Whiskers
Green Compliance | Industry Consortia | Questions & Answers | Literature

Lead-Free Strategies

• Roadmap to Compliance of the EU's RoHS and WEEE Directives
  L. Nguyen and R. Walberg, Lead-Free Electronics, Special Issue of Advanced Packaging, June 2005.
• A Structured Approach to Lead-Free IC Assembly Transitioning
  L. Nguyen, R. Walberg, Z. Lin, T. Koh, Y. Y. Bong, M. C. Chua, S. Chuah, and J. J. Yeoh, 27th Int. Electron. Manuf. Tech. Symp., Santa Clara, CA, July (2002).

Lead-Free Reliability

• Fatigue Crack Growth and Life Descriptions of Sn3.8Ag0.7Cu Solder Joints: A Computational and Experimental Study
  D. Bhate, D. Chan, G. Subbarayan, and L. Nguyen, 57th Electron. Comp. & Tech. Conf., May 29-June 1, Reno, NV (2007).
• Effect of Temperature on the Drop Reliability of Wafer-Level Chips Scale Packaged Electronic Assemblies
  T. T. Mattila, R. J. James, L. Nguyen, and J. K. Kivilahti, 57th Electron. Comp. & Tech. Conf., May 29-June 1, Reno, NV (2007).
• Influence of Solder Microstructure and Oxide Layers on High Frequency Electrical Losses of WL-CSP Pb-free Interconnections
  D. Burlacu, L. Nguyen, and J. Kivilahti, 56th Electron. Comp. & Tech. Conf., pp. 577-583, May 30-June 2, San Diego, CA (2006).
• Reliability of Chip Scale Packages under Mechanical Shock Loading
  T. T. Mattila, J. Kivilahti, and L. Nguyen, 56th Electron. Comp. & Tech. Conf., pp. 584-589, May 30-June 2, San Diego, CA (2006).
• Constitutive Relationship Development, Modeling, and Measurement of Heat Stressing of Micro SMD Assembly with Sn3.9Ag0.6Cu SAC
  S. Chaparalla, Q. Xiao, W. D. Armstrong, J. M. Pitarresi, B. Samakia, InterPack ‘05, July17-22, San Francisco, CA (2005).
• High Resolution Characterization of Materials Used In Packages Through Digital Image Correlation
  V. Srinivasan, S. Radhakrishnan, X. Zhang, G. Subbarayan, T. Baughn, and L. Nguyen, InterPack ‘05, July 17-22, San Francisco, CA (2005).
• Flexural Testing of Board Mounted Wafer Level Packages for Handheld Devices
  V. Patwardhan, D. Chin, S. Wong, E. Rey, N. Kelkar, and L. Nguyen, 55th Electron. Comp. & Tech. Conf., pp. 557-561, May 31-June 3, Lake Buena Vista, FL (2005).
• Drop Test Reliability of Wafer Level-Chip Scale Packages
  M. Alajoki, L. Nguyen, and J. Kivilahti, 55th Electron. Comp. & Tech. Conf., pp. 637-644, May 31-June 3, Lake Buena Vista, FL (2005).
• Effects of the Solder Oxide Layer on High Frequency Signal Propagation in Pb-Free Interconnections
  D. Burlacu, L. Nguyen, and J. Kivilahti, 55th Electron. Comp. & Tech. Conf., pp. 1874-1879, May 31-June 3, Lake Buena Vista, FL (2005).
• Powercycling Reliability and Acceleration Factors of Pb-Free Solder Joints
  K. M. Setty, G. Subbarayan, and L. Nguyen, 55th Electron. Comp. & Tech. Conf., pp. 907-915, May 31-June 3, Lake Buena Vista, FL (2005).
• Simulated Power Cycling for Rapid Reliability Assessment of Pb-Free Packages
  K. Setty, G. Subbarayan, L. Nguyen, D. Love, and R. Sullivan, ASME Int. Mechanical Engineering Congress, Anaheim, CA (2004).
• The Anomalous Microstructural, Tensile, and Aging Response of Thin Cast Sn3.9Ag0.6Cu Lead-Free Solder
  Q. Xiao, L. Nguyen, and W. Armstrong, J. Electronic Materials, Vol. 34, Issue No. 5, pp. 617-624 (2004).
• Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy
  Q. Xiao, L. Nguyen, and W. Armstrong, 54th Electron. Comp. & Tech. Conf., pp. 1325-1332, June 1-4, Las Vegas, NV (2004).
• Solder Joint Reliability Model with Modified Darveaux’s Equations for the micro-SMD Wafer Level-Chip Scale Package Family
  L. Zhang, R. Sitaraman, V. Patwardhan, L. Nguyen, and N. Kelkar, 53rd Electron. Comp. & Tech. Conf., pp. 572-577, May 27-30, New Orleans, LA (2003).
• Synchrotron Radiation Micro-Diffraction Study of Sn Whiskers on Pb-Free Surface Finish
  W. J. Choi, T. Y. Lee, K. N. Tu, N. Tamura, R. S. Celestre, A. A. MacDowell, Y. Y. Bong, and L. Nguyen, Acta Materials, 51, 6253-6261 (2003).
• Board Level Reliability of Components with Matte Tin Lead Finish
  L. Nguyen, R. Walberg, L. Zhou, and T. Koh, 53rd Electron. Comp. & Tech. Conf., May 27-30, New Orleans, LA (2003).
• Tin Whiskers Studied by Focused Ion Beam Imaging and Transmission Electron Microscopy
  G. T. T. Sheng, C. F. Hu, W. J. Choi, K. N. Tu, Y. Y. Bong, and L. Nguyen, J. Applied Physics, Vol. 92, No. 1, pp. 64-69, July 2002.
• Lead-Free Wafer Level Chip Scale Package: Assembly and Reliability
  V. Patwardhan, L. Nguyen, and N. Kelkar, 52nd Electron. Comp. & Tech. Conf., May 28-31, San Diego, CA (2002).
• Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish
  W. J. Choi, T. Y. Lee, K. N. Tu, N. Tamura, R. S. Celestre, A. A. MacDowell, George T. T. Sheng, Y. Y. Bong, and L. Nguyen, 52nd Electron. Comp. & Tech. Conf., pp. 628-633, May 28-31, San Diego, CA (2002).

Electromigration

• Effect of Current Crowding on Void Propagation at the Interface between Intermetallic Compound and Solder in Flip Chip Joints
  L. Zhang, S. Ou, J. Huang, K. Tu, S. Gee, and L. Nguyen, Applied Physics Letters, 88, 012106-1 (2006).
• Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps
  S. Gee, L. Nguyen, J. Huang, and K. N. Tu, International Wafer Level Packaging Conf., Nov. 3-4, San Jose, CA (2005).
• The Effect of Electromigration on Eutectic SnPb and Pb-Free Solders in Wafer Level-Chip Scale Packages
  J. Huang, K. N. Tu, S. Gee, and L. Nguyen, SRC TechCon 2005, October 24-26, Portland, OR (2005).
• Lead-Free and PbSn Bump Electromigration Testing
  S. Gee, N. Kelkar, J. Huang, and K. N. Tu, InterPack ‘05, July17-22, San Francisco, CA (2005).

Packaging | Lead-Free Status | Impact to Customers | Tin Whiskers
Green Compliance | Industry Consortia | Questions & Answers | Literature