Micro SMD Application Note Home->Packaging Information

Micro SMD
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Micro SMD
AN-1112

 

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Micro SMD (Surface-Mount Device) is a chip-size package and was developed by National Semiconductor. It is the same size as the silicon chip and is available in 4-, 5-, and 8-I/O packages. The advantages of micro SMD compared with traditional leaded plastic packages include:

  • Small footprint
  • High I/O density
  • Better electrical & thermal performance
  • Easy board assembly
  • Level 1 moisture sensitivity performance
  • Noise reduction

General information about the carrier tapes used for wafer level packages (eg. micro SMD) can be found at the following link. The contents of the link/webpage is maintained by 3M™ and is added here for a reference only:

Additional Resources, Datasheets and Application information for carrier tapes is available at the following link. The contents of the links/webpages are maintained by 3M™ and are added here for a reference only:

 
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WEBENCH® Design Tools
Products
  • DS92LV3241/42 - 20-85 MHz 32-Bit Channel Link II Serializer/Deserializer
  • LM98722 - Three Channel, 16-Bit, 45 MSPS Analog Front End with LVDS/CMOS Output and Integrated CCD/CIS Sensor Timing Generator
  • LMV841Q - CMOS Input, RRIO, Wide Supply Range Operational Amplifiers
  • ADC10D1500 - Low Power, 10-Bit, Dual 1.0/1.5 GSPS or Single 2.0/3.0 GSPS ADC
  • LM3424Q - Constant Current N-Channel Controller with Thermal Foldback for Driving LEDs
  • DS90UR90xQ Family - 5 to 65 MHz 24-bit Color Automotive Grade FPD-Link II Serializer/Deserializer Chipsets
  • LM5027 - Voltage Mode Active Clamp Controller
  • LM3530 - High Efficiency, Multi Display LED Driver with 128 Exponential Dimming Steps & Integrated OLED Power Supply in 1.2mm × 1.6mm µSMD Package

 

 

PowerWise® Solutions

 

 

SolarMagic™ Technology



Maximizing Solar Panel Efficiency

National's SolarMagic™ technology recoups up to 50 percent of the lost energy, dramatically improving the economics in shaded and other real-world conditions.



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