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National's Enhanced Solutions has introduced a Ceramic SOIC package which offers a hermetic Surface Mount Package with Gull Wings leads. The portfolio of fully qualified products is shown below.
Features and Benefits
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SOIC Vs. DIP
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- Emulates JEDEC standard for wide body (300mil) SOICs
- 37% smaller footprint than ceramic DIP
- 61% profile reduction
- 80% weight reduction*
- Surface mount technology
- 10, 14, 16 & 20 leads packages available
- Excellent thermal characterisitcs for heat sensitive applications
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* typical value - actual reduction varies by package and die type
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- ADC08D1520WGFQV (pdf 174KB)
ADC08D1520WGFQV Dual Channel, 8-Bit, 1.5 GSPS Analog-to-Digital Converter with Latch-up Levels of 120 MeV and 300 krad (Si)
- ADC10D1000 (pdf 531KB)
Highest Performance, Lowest Power Dual 10-bit 1 GSPS Space-Qualified ADC
- ADC14155 (pdf 55KB)
1.1 GHz Bandwidth ADC Enables High IF-Sampling for Space-Based Narrowband Communications Applications
- Dual, High Precision, Rail-to-Rail Output Operational Amplifier
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