|
National Semiconductor has comprehensive occupational health and safety programs governed by three sets of interactive requirements: (1) applicable laws and regulations, (2) the OHSAS 18001:1999 occupational health and safety management system specification and (3) our internal health and safety standards, which are often stricter than regulatory requirements.
OSHA Injury Rates
 The effectiveness of National's programs is demonstrated by a low and declining OSHA recordable injury rate, consistently lower than the semiconductor industry rate. The OSHA recordable injury rate is a measure of injury frequency. We also track our OSHA rate for days away from work because of injury, an indication of injury severity, and our OSHA rate for days our employees work with restrictions because of injury. All OSHA rates are based on 100 full-time equivalent employees (FTE), which is equal to 200,000 working hours per year.
National's 2006 OSHA recordable rate of 0.42 was 11% below our 2005 rate and 74% lower than the 2005 U.S. Bureau of Labor Statistics rate for the semiconductor industry. It represents a 65% reduction over five years. Our 2006 OSHA rate for days away was 1.42, a 119% increase over 2005, but an 81% reduction over five years. Our OSHA restricted day rate increased 56% in 2006 to 8.30 but has declined 42% over the past five years. National's goal for 2007 is to reduce our OSHA recordable rate by 5% and to get our OSHA days away and restricted day rates back on the track of consistent reduction. Our focus is on ergonomic injuries, which account for approximately 50% of our recordable injuries.
OSHA Injury Rate Information
Safe Workplace
A primary focus of National's occupational health and safety program is to provide a safe workplace. Semiconductor manufacturing equipment is often unique and very complex. Consequently, new semiconductor manufacturing equipment is assessed by a certified third-party assessor for conformance with Semiconductor Equipment and Materials International's SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment and SEMI S8 Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment EHS and Ergonomic Standards. Conditions that pose a potentially serious health and safety risk are corrected prior to shipment. After installation manufacturing equipment at National passes through a rigorous internal EHS assessment before it can be put into production.
Semiconductor wafer fabrication processes require the use of a number of hazardous chemicals and gases. National employs multiple levels of protection to enable the safe use of chemicals and gases and to prevent employee exposure to chemical hazards. Our fabrication areas have state-of-art, automated systems to distribute chemicals and gases to processing equipment. These systems are secondarily contained, ventilated and monitored for leaks. Workplaces are continuously monitored for toxic gases by sophisticated detection systems. If any toxic gas is detected at the occupational exposure limit, the process is automatically shutdown and employees are alerted to evacuate.
 |
|
 |
| Chemical Handling PPE - Melaka, Malaysia |
|
Hazardous Gas Monitoring - Arlington, Texas |
Periodic workplace and personal industrial hygiene monitoring is also conducted by trained health and safety professionals. Employees are supplied with and use appropriate personal protective equipment (PPE). They are trained to handle chemicals safely, understand the hazards of the chemicals they use, immediately report all spills and leaks and to evacuate if they detect a chemical odor.
 |
| High Voltage Electricity PPE - Melaka, Malaysia |
Other potential hazards, such as electrical and mechanical hazards, are similarly addressed. Machinery is equipped with guards, interlocks and other safeguards. Employees have and use appropriate PPE. They are trained on equipment specific operating procedures, which specify how to correctly and safely operate and maintain the equipment. We assess jobs for risks to employee health and safety. Engineering controls and other strategies are used to eliminate identified risks.
| 
