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Technical Information Overview

The engineering group within the DPBU provide valuable assistance to customers, especially those converting designs to use die.
To assist with the ever changing technology which surrounds the use of die / wafer, Technical Seminars are often offered around the world. For more information contact either your local sales office or contact the DPBU directly.

 

Application Notes

 

White Papers

 

Shipping Mediums

  • Overview
  • Waffle Pack
  • Gel-Pak
  • Tape & Reel
  • Wafers
 

System Solutions

 

Other

  • Datasheets (available upon request)

 

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