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National's DPBU uses several methods to ship die to our customers. The option used is based on the customer's requirement and the number of die involved.
National Semiconductor has several methods for shipment of die and wafers to our customers. The shipping option used is based on the customer's requirements and the number of die being shipped. Both the die and whole wafers are available on a majority of our product.
Whole wafers are shipped in plastic wafer containers which hold up to 25 wafers.
For die shipments, customers have a few choices. Those choices include waffle packs, Gel-Paks, tape-on-reel, or as sawn wafers.
Waffle pack or Gel-Pak® trays come in either a 2" or 4" tray size. The die capacity of the tray depends upon the die size. The tape-on-reel method uses Surf Tape to hold the individual die in place. The reels come in 7" diameter with either an 8mm or a 12mm width. A 7" diameter reel with a width of 8mm can hold 7000 die, and one with a 12mm width can hold 3000 die. The other way to ship die is as a sawn wafer mounted on sticky tape supported by a film frame. The customer receives the whole wafer and picks the die off themselves.
If no shipping method is specified at the time of the request for quote (RFQ) by the customer, National will ship in either a waffle pack or Gel-Pak at their discretion.
Typical shipping methods included:
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