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The Die Product naming convention provides positive identification for all critical aspects of the die selection process.
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NOTES:
1. Certain combinations of product suffix (configuration, screening level, pack method) may not be valid. Valid suffix combinations are controlled via National's Product definition system.
Examples:
| LM319 MWA |
Analog, Operational Amplifier Guaranteed bare die in wafer form. Shipped in wafer vial. |
| LM319 MDC |
Analog, Operational Amplifier die product in die form; Commercial grade screening; shipped in waffle pack. |
| LM319 MWC |
Analog, Operational Amplifier die product in wafer form; Commercial grade screening; shipped in wafer vial. |
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| Suffix |
Description |
| MDA / MWA |
Commercial bare die/wafer products with quality, reliability, functionality and performance equivalent to packaged product. Levels of testing may vary but as a minimum includes 100% functional DC probe at room temperature. Meets commercial wafer fab and visual standards. Warranted to the standard packaged product electrical specifications. C of C is provided. Shipping medium is waffle / Gel-Pak®, Tape & Reel or Film Frame. Wafer vial for wafers. |
| MDC / MWC |
Commercial bare die/wafer products that are processed to commercial wafer fab and visual standards. Levels of testing may vary but as a minimum includes 100% functional DC probe at room temperature. Offered with conditional performance guarantee to the standard packaged product electrical specifications. Full datasheet electrical performance is not guaranteed. C of C is provided. Shipping medium is waffle / Gel-Pak®, Tape & Reel or Film Frame. Wafer vial for wafers. |
| MD8 / MW8 |
(B Level) are bare die/wafer products processed to military Level B wafer fab standards and visual criteria. Levels of testing may vary but as a minimum includes 100% functional DC probe at room temperature guard banded for military temperature range. Offered with conditional performance guarantee to the standard packaged product electrical specifications. Full datasheet performance or Military Data Sheet parameters are not guaranteed. C of C is provided. Shipping medium is waffle / Gel- Pak®, Tape & Reel or Film Frame. Wafer vial for wafers. |
| MDS |
(Space Level - Non Rad) are bare die products processed to Level S military wafer fab and visual standards, including SEM (Scanning Electron Microscope), and WLA, (Wafer Lot Acceptance). Product is 100% functional DC probe at room temperature guard banded to the Level S temperature range. Electrical performance to Class S Slash Sheets or SMD is not guaranteed. C of C is provided. Shipping medium is waffle/ Gel-Pak® or Tape & Reel. |
| MDE |
(Space Level ELDRS) are bare die products having completed low dose radiation testing and processed to Level S military wafer fab and visual standards, including SEM and WLA. Product is 100% functional DC probe at room temperature guard banded to the Level S temperature range. Electrical performance to a Class S Slash Sheet or SMD is not guaranteed. C of C is provided. Shipping medium is waffle/ Gel-Pak® or Tape & Reel. |
| MDR |
(Space Level Radiation) are bare die products processed to Level S military wafer fab and visual standards, including SEM and WLA. Product is 100% functional DC probe at room temperature guard banded to the Level S temperature range. Electrical performance to Class S Slash Sheets or SMD is not guaranteed. C of C is provided. Shipping medium is waffle/ Gel-Pak® or Tape & Reel. |
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