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A
AC test measurement of dynamic or switching electrical parameters
AOI automated optical inspection
Ag silver
Al aluminum
Au gold
B
BGA ball grid array
Bare die unpackaged integrated circuit die
C
C capacitance
COB chip-on-board
COF chip-on-flex
COS chip-on-substrate
CSP chip scale package
CTE coefficient of thermal expansion
Cu copper
D
DC test measurement of static electrical parameters
DCA direct chip attach
DIP dual-inline-package
E
EMI electromagnetic interference
ESD electrostatic discharge
F
FCP few-chip package
Film frame sawn wafer on sticky tape supported by a metal frame
G
GND ground
Gel Pack tray used to ship unpackaged die that requires vacuum to remove die
H
HDI high density interconnect
I
IC integrated circuit
I/O input/output
J
JEDEC joint electronic device engineering council
K
L
L inductance
LTCC low temperature co-fired ceramic
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M
MCM multichip module
MCP multichip package
Mil-PRF-38534 general quality and reliability assurance specification for hybrids
Mil-PRF-38535 general quality and reliability assurance specification for microcircuits
Mil-Std-883 test methods and procedures for microcircuits
N
N nitrogen
Ni nickel
O
P
Pb lead
PBGA plastic ball grid array
Pd palladium
PWB printed wiring board
Q
QFP quad flat pack
R
R resistance
RGA residual gas analysis
RF radio frequency
S
SEM scanning electron micrograph
SIP system-in-package
SMD surface mount device
SMT surface mount technology
SOC system-on-chip
SPC statistical process control
T
TAB tape automated bonding
Tg glass transition temperature
Tape & reel shipping method utilizing 7 inch reels
U
uSMD micro-surface mount device
UV ultraviolet
V
W
WLA wafer lot acceptance
WL-CSP wafer level chip scale package
WLP wafer level packaging
Waffle packs trays used to ship unpackaged die with individualized pockets
Wire bond die interconnect method utilizing wire with active side up
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