|
FAQ’s
Q: What types of products are available from National Semiconductor in die form?
A: A majority of National’s standard packaged products are available in die form.
Q: What is the difference between MDA and MWA?
A: MDA designates product delivered as individual die and MWA is delivered in whole wafer form.
Q: What is the difference between MDA/MWA and MDC/MWC?
A: Die products are categorized into two levels of quality assurance. The first category is identified and ordered by the suffix identifier MDA (die) and MWA (wafer). MDA and MWA die products are warranted to the standard package product electrical specifications and reliability levels. The second category is identified and ordered by the suffix identifier MDC (die) and MWC (wafer). MDC and MWC die products have an equivalent reliability assurance as MDA and MWA die products but due to restrictions in die level processing are not guaranteed to be equivalent to the standard packaged product electrical specifications. MDC and MWC products are offered with a conditional performance guarantee to the standard product electrical specifications. Minimal yield impact to the application is expected but characterization of MDC and MWC die products by the user in their application is recommended. All National die products are 100% tested at the wafer level and are manufactured using our established, mature, stable processes that have been well characterized. This insures that MDC and MWC products are reliable and suitable for a wide variety of applications.
Q: Can National die be wire bonded with both aluminum and gold wire?
A: National’s die products have bond pads made up primarily of aluminum. As a result both aluminum and gold wire can be utilized.
Q: Does National offer die for Space applications?
A: National offers Space Level die including radiation tolerant and ELDRS free. Contact the Die Products Group at Contact Us/Feedback for more information.
Q: Where can I find information on backside bias potential of a specific die product?
A: Backside bias potential along with other assembly information required to integrate die into an application can be found on the die products datasheets. Datasheets are available thru our web site found at http://www.national.com/analog/die/
Q: Can I get die product in any shipping format I want?
A: National Semiconductor utilizes several methods for shipment of die and wafers to our customers. The shipping option used is based on standard industry requirements and the number of die being shipped. Both die and whole wafers are available on a majority of our product. Details of the standard National shipping media can be reviewed at http://www.national.com/analog/die/shipping_media_options
Be sure to specify shipping method at the time of your request for quote (RFQ). When the shipping method is not specified, National will ship in either waffle pack or Gel Pak, at our discretion.
Q: What about thermal resistance? It’s not listed on the datasheet.
A: Unlike packaged die, National does not control the critical elements that are the most significant in contributing to incorporated die thermal resistance. As a result it is not possible to define thermal resistance in the same manner as packaged die. We can assist customers in determining the contribution of the die to the total thermal resistance, contact us at Contact Us/Feedback.
Q: Do all die from National Semiconductor have the same bond pad metal?
A: All die from National Semiconductor use aluminum as the basis for the pad metal but we do incorporate silicon and copper into our pad metals.
Q: We are evaluating replacing packaged product with unpackaged die. How can National Semiconductor assist us in this evaluation?
A: National Semiconductor offers a series of technical seminars to assist customers in various stages of evaluation, design and manufacture. More information and links to our seminars can be found on the Die Products Home Page.
|
