ES DPBU - Apps Note (DP-0101) COB & FC Assembly Home->Die Products

Chip-on-Board and Flip Chip Assembly

DPBU Application Note

Click here to download this article in its original published format as an Adobe Acrobat PDF document. (433K pdf)

A text-only version of the article (without figures and tables) is available below.

Contents

Introduction

  •  Peripheral
  • Area Array
  • Wirebond
  • Bumped

Implementation formats

  • Chip on Board
  • Flip Chip
    Assembly Considerations
    • Process Flow
    • Key Issues
    • Design Guidelines
    • Substrate Properties
  

Contents

Assembly Options

Electrical Performance

Handling

 
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