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A wide variety of die assembly methods and materials are available for implementation into high yield, high reliability systems. Some of the options for die interconnect are reviewed here for comparison.
Gold-Ball Bond
Advantages: high throughput, high strength, omni-directional, fine pitch
Disadvantages: elevated temperature, increased material cost, intermetallic potential
Process Considerations: temperature, power, force, time, wire diameter, wire length, metallurgy, pitch, bonding surface conditions, bonding area
Aluminum Wedge Bond
Advantages: room temperature processing, lower material cost (wire), fine pitch
Disadvantages: Strength, throughput, not optimum for non-hermetric applications
Process Considerations: power, force, time, wire diameter, wire length, metallurgy, pitch, bond angle, forward/reverse bonding, bonding surface conditions, bonding area
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