Overview: Handheld, portable and wireless
products continue to be driven by the need for reduction in size and weight
while at the same time meeting the demand for increased functionality and
performance. Component integration and the miniaturization of the electronic
assemblies enables manufacturers to create these smaller, lighter, high
performance products. Die assemblies, whether implemented as chip-on-board
or flip chip, provide the required system performance and integration advantages.
From design to manufacture, understanding the benefits and trade-offs
of utilizing unpackaged semiconductor die is key to an assembly manufacturer's
successful conversion from Surface Mount Technology to bare die assemblies.
This seminar will discuss the factors driving use of bare semiconductor
die, various interconnection options, and considerations for implementing
die assembly technology in the SMT manufacturing process.
Length: 60 minutes
Published Date: June 2003
Topics covered in this online seminar include:
- The primary factors driving your conversion to die
- The tradeoffs for various interconnection techniques when using die
- Helpful die resources
- Implementing die assembly technology in your current manufacturing
process
Presenter: Mark McClintick is
a Process Engineer with National Semiconductor's Die Products Group in South
Portland, ME. |
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