Overview: Component integration and
the miniaturization of electronic assemblies enable manufacturers to create
smaller, lighter, high performance products. Wire bond interconnect, whether
implemented in the form of Chip-on-Board (COB) or multiple die assemblies,
continues to be a critical technology in creating high performance and highly
integrated systems.
From design to manufacture, understanding the central considerations
in wire bond assemblies is key to assembly manufacturers creating competitive
and robust processes, and successfully implementing this technology.
This seminar will discuss critical issues for reliable COB and multiple
die assembly manufacturing, implementation in the SMT manufacturing environment,
as well as general PCB / substrate layout and thermal considerations.
Length: 60 minutes
Published Date: September 2003
Topics covered in this online seminar include:
- Manufacturing process considerations from "die attach" to
"encapsulation"
- Review mixed SMT device and multi-die manufacturing approaches
- Design and thermal considerations
Presenter: Mark McClintick is
a Process Engineer with National Semiconductor's Die Products Group in South
Portland, ME. |
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